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March 18, 2019 09:03 pm

US Reveals Details of $500 Million Supercomputer

An anonymous reader quotes a report from The New York Times: The Department of Energy disclosed details on Monday of one of the most expensive computers being built: a $500 million machine based on Intel and Cray technology that may become crucial in a high-stakes technology race between the United States and China (Warning: source may be paywalled; alternative source). The supercomputer, called Aurora, is a retooling of a development effort first announced in 2015 and is scheduled to be delivered to the Argonne National Laboratory near Chicago in 2021. Lab officials predict it will be the first American machine to reach a milestone called "exascale" performance, surpassing a quintillion calculations per second. That's roughly seven times the speed rating of the most powerful system built to date, or 1,000 times faster than the first "petascale" systems that began arriving in 2008. Backers hope the new machines will let researchers create significantly more accurate simulations of phenomena such as drug responses, climate changes, the inner workings of combustion engines and solar panels. Aurora, which far exceeds the $200 million price for Summit, represents a record government contract for Intel and a test of its continued leadership in supercomputers. The Silicon Valley giant's popular processors -- the calculating engine for nearly all personal computers and server systems -- power most such machines. But additional accelerator chips are considered essential to reach the very highest speeds, and its rival Nvidia has built a sizable business adapting chips first used with video games for use in supercomputers. The version of Aurora announced in 2015 was based on an Intel accelerator chip that the company later discontinued. A revised plan to seek more ambitious performance targets was announced two years later. Features discussed on Monday include unreleased Intel accelerator chips, a version of its standard Xeon processor, new memory and communications technology and a design that packages chips on top of each other to save space and power.

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