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March 21, 2022 02:01 pm GMT

(PR) AMD Announces 3rd Gen EPYC 7003 Processors with 3D Vertical Cache Technology, $4,000 to $8,000

AMD announced the general availability of the world's first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, formerly codenamed "Milan-X." Built on the "Zen 3" core architecture, these processors expand the 3rd Gen EPYC CPU family and can deliver up to 66 percent performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked 3rd Gen AMD EPYC processors.

These new processors feature the industry's largest L3 cache delivering the same socket, software compatibility and modern security features as 3rd Gen AMD EPYC CPUs while providing outstanding performance for technical computing workloads such as computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA) and structural analysis. These workloads are critical design tools for companies that must model the complexities of the physical world to create simulations that test and validate engineering designs for some of the world's most innovate products.

Original Link: https://www.techpowerup.com/293123/amd-announces-3rd-gen-epyc-7003-processors-with-3d-vertical-cache-technology-usd-4-000-to-usd-8-000

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