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May 6, 2021 11:30 am GMT
Original Link: https://www.androidheadlines.com/2021/05/samsung-i-cube4-packaging-tech-chips-faster-power-efficient.html
New Samsung Tech Makes Chips Faster & More Power-Efficient
Samsung has developed a new chip packaging technology that could significantly improve the speed and power-efficiency of semiconductor chips. The new Interposer-Cube4 (I-Cube4) technology is the successor to the company’s I-Cube2 technology from 2018 and a follow-up to its X-Cube technology announced in August 2020. Samsung’s I-Cube is a 2.5D heterogeneous integration technology that connects [...]
The post New Samsung Tech Makes Chips Faster & More Power-Efficient appeared first on Android Headlines.
Original Link: https://www.androidheadlines.com/2021/05/samsung-i-cube4-packaging-tech-chips-faster-power-efficient.html
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