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August 13, 2020 09:04 pm GMT

Samsung X-Cube 3D Stacking Could Improve Mobile Chips For Everything

Samsung has pushed forward with another industry-first, applying a 3D stacking to a 7nm EUV system chips. Dubbed X-Cube, the concept is at once complex and straightforward. In effect, Samsung has taken system semiconductor components and stacked them with SRAM in a more cube-like orientation. But the simplicity of that statement, as noted by numerous [...]

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The post Samsung X-Cube 3D Stacking Could Improve Mobile Chips For Everything appeared first on Android Headlines.


Original Link: https://www.androidheadlines.com/2020/08/Samsung-x-cube-3d-stacking-chips-sram.html

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