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September 16, 2021 05:55 am GMT
As rack density increases along with higher TDP chips, air cooling may not be the best option and direct liquid cooling will deliver stable and higher performance. Thanks to the ability of water to dissipate heat faster than air, direct liquid cooling options have arisen to meet data center workloads. GIGABYTE has engineered two servers, H262-ZL0 for cooling only the CPUs and H262-ZL2 for cooling CPUs, memory, and an NVIDIA Mellanox ConnectX -6.
Original Link: https://www.techpowerup.com/286767/gigabyte-debuts-liquid-cooled-high-density-servers-powered-by-coolit-and-amd-epyc
(PR) GIGABYTE Debuts Liquid Cooled High-density Servers Powered by CoolIT and AMD EPYC
GIGABYTE Technology,, an industry leader in high-performance servers and workstations, today announced two high-density servers, H262-ZL0 and H262-ZL2, with direct liquid cooling for CPUs and more. Engineered to cool up to eight CPUs in a 4-node 2U chassis, the liquid cooled servers offer necessary cooling to ensure 280 W versions of AMD EPYC 7003 series processors can perform at their stable, maximum potential. To this end, the GIGABYTE H262 servers come with a cooling kit provided by CoolIT Systems. The development of H series servers with multiple nodes will meet the needs of HPC, HCI, in-memory computing, and scientific research.As rack density increases along with higher TDP chips, air cooling may not be the best option and direct liquid cooling will deliver stable and higher performance. Thanks to the ability of water to dissipate heat faster than air, direct liquid cooling options have arisen to meet data center workloads. GIGABYTE has engineered two servers, H262-ZL0 for cooling only the CPUs and H262-ZL2 for cooling CPUs, memory, and an NVIDIA Mellanox ConnectX -6.
Original Link: https://www.techpowerup.com/286767/gigabyte-debuts-liquid-cooled-high-density-servers-powered-by-coolit-and-amd-epyc
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