Some of Our Sources
- Joshua Blankenship
- Pearsonified
- The Logo Smith
- Smashing Magazine
- Smashing Apps
- Vandelay Design
- Crazy Leaf Design
- Web Design Ledger
- CSS Tricks
- Dev To
Help Webnuz
Referal links:
December 4, 2015 08:00 pm
Original Link: http://rss.slashdot.org/~r/Slashdot/slashdot/~3/jWx_tw5vcFU/intel-skylake-cpus-are-warping-under-mounting-pressure-from-third-party-coolers
Intel Skylake CPUs Are Warping Under Mounting Pressure From Third-Party Coolers
MojoKid writes: It's been discovered that some third-party heat sinks can physically damage Intel's new Skylake CPUs, along with the pins in the accompanying motherboard socket. The problem has prompted at least one cooler maker to change the design of its Socket 1151 heat sinks and it wouldn't be surprising if others soon followed suit. The apparent issue is the substrate Intel used for its Skylake chips. A close-up shot of a Skylake CPU sitting side-by-side with a Broadwell processor (Google translation of German original) shows that the substrate is noticeably thinner on Skylake, and thus prone to bending from the force that some third-party heat sinks exert.Read more of this story at Slashdot.
Original Link: http://rss.slashdot.org/~r/Slashdot/slashdot/~3/jWx_tw5vcFU/intel-skylake-cpus-are-warping-under-mounting-pressure-from-third-party-coolers
Share this article:
Tweet
View Full Article
Slashdot
Slashdot was originally created in September of 1997 by Rob "CmdrTaco" Malda. Today it is owned by Geeknet, Inc..More About this Source Visit Slashdot