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September 18, 2023 01:16 pm GMT
"After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come."
-Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development
Original Link: https://www.techpowerup.com/313744/intel-unveils-industry-leading-glass-substrates-to-meet-demand-for-more-powerful-compute
(PR) Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
What's New: Intel today announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver data-centric applications."After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come."
-Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development
Original Link: https://www.techpowerup.com/313744/intel-unveils-industry-leading-glass-substrates-to-meet-demand-for-more-powerful-compute
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