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July 27, 2022 01:32 pm GMT

(PR) Winbond's LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2. The device is ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce the PCB size for more compact IoT designs.

Winbond's LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267 Mbps. It is available in both Single-Die-Package (SDP) with a 2Gb density and Dual-Die-Package (DDP) with a 4Gb density. The higher speed of LPDDR4 1CH x16 4267 Mbps offers improved performance over previous DDR4 x16 3200 Mbps devices, which is especially useful for consumer applications.

Original Link: https://www.techpowerup.com/297215/winbonds-lpddr4-4x-100bga-achieves-jedec-standard-for-improved-energy-conservation-and-carbon-reduction-in-a-smalle

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