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May 23, 2022 05:00 pm GMT

Intel to Present Meteor/Arrow Lake with Foveros 3D Packaging at Hot Chips 34

Hot Chips 34, the upcoming semiconductor conference from Sunday, August 21 to Tuesday, August 23, 2022, will feature many significant contributions from folks like Intel, AMD, Tesla, and NVIDIA. Today, thanks to Intel's registration at the event, we discovered that the company would present its work on Meteor Lake and Arrow Lake processors with the novel Foveros 3D packaging. The all-virtual presentation from Intel will include talks about Ponte Vecchio GPU and its architecture, system, and software; Meteorlake and Arrowlake 3D Client Architecture Platform with Foveros; and some Xeon D and FPGA presentations. You can see the official website here for a complete list of upcoming talks.

As a little reminder, Meteor Lake is supposed to arrive next year, replacing the upcoming Raptor Lake design, and it has already ahs been pictured, which you can see below. The presentation will be recorded and all content posted on Hot Chips's website for non-attendees to catch up on.

Original Link: https://www.techpowerup.com/295173/intel-to-present-meteor-arrow-lake-with-foveros-3d-packaging-at-hot-chips-34

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