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March 30, 2022 11:52 am GMT
Earlier this month, the company was recognized for its continuous innovation and contribution to heterogeneous integration technologies with a 3D InCites "Equipment Supplier of the Year" award.
ERS is now giving a first look at the next-generation ADM330, which has changed its previously matte metallic appearance to a clean, white surface matching most equipment found in a cleanroom. In addition, the machine is now fully compliant with the GEM300 SEMI standards, thus allowing seamless integration into automated fabs and Industry 4.0 architectures. Warpage adjustment performance has also been improved thanks to a unique thermal chuck design that enables a strong vacuum performance three times better than its predecessor. Lastly, the new ADM330 offers an implemented add-on software feature allowing stand-alone laser marking for improved wafer traceability.
Original Link: https://www.techpowerup.com/293449/ers-electronic-unveils-its-third-generation-flagship-thermal-debond-machine
(PR) ERS electronic unveils its third-generation flagship thermal debond machine
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and can be found on the production floors of most semiconductor manufacturers and OSATs involved in Advanced Packaging worldwide.Earlier this month, the company was recognized for its continuous innovation and contribution to heterogeneous integration technologies with a 3D InCites "Equipment Supplier of the Year" award.
ERS is now giving a first look at the next-generation ADM330, which has changed its previously matte metallic appearance to a clean, white surface matching most equipment found in a cleanroom. In addition, the machine is now fully compliant with the GEM300 SEMI standards, thus allowing seamless integration into automated fabs and Industry 4.0 architectures. Warpage adjustment performance has also been improved thanks to a unique thermal chuck design that enables a strong vacuum performance three times better than its predecessor. Lastly, the new ADM330 offers an implemented add-on software feature allowing stand-alone laser marking for improved wafer traceability.
Original Link: https://www.techpowerup.com/293449/ers-electronic-unveils-its-third-generation-flagship-thermal-debond-machine
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