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March 23, 2022 01:14 am GMT

(PR) NVIDIA Opens NVLink for Custom Silicon Integration

Enabling a new generation of system-level integration in data centers, NVIDIA today announced NVIDIA NVLink -C2C, an ultra-fast chip-to-chip and die-to-die interconnect that will allow custom dies to coherently interconnect to the company's GPUs, CPUs, DPUs, NICs and SOCs. With advanced packaging, NVIDIA NVLink-C2C interconnect would deliver up to 25x more energy efficiency and be 90x more area-efficient than PCIe Gen 5 on NVIDIA chips and enable coherent interconnect bandwidth of 900 gigabytes per second or higher.

"Chiplets and heterogeneous computing are necessary to counter the slowing of Moore's law," said Ian Buck, vice president of Hyperscale Computing at NVIDIA. "We've used our world-class expertise in high-speed interconnects to build uniform, open technology that will help our GPUs, DPUs, NICs, CPUs and SoCs create a new class of integrated products built via chiplets."

Original Link: https://www.techpowerup.com/293197/nvidia-opens-nvlink-for-custom-silicon-integration

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