An Interest In:
Web News this Week
- April 15, 2024
- April 14, 2024
- April 13, 2024
- April 12, 2024
- April 11, 2024
- April 10, 2024
- April 9, 2024
Some of Our Sources
- Mashable
- Techcrunch
- TutsPlus - Code
- Team Treehouse
- Abduzeedo
- TutsPlus - Design
- Creative Curio
- Specky Boy
- CSS Tricks
- Dev To
Help Webnuz
Referal links:
May 6, 2021 01:43 am GMT
Samsung's new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.
Original Link: https://www.techpowerup.com/281819/samsung-announces-availability-of-its-next-generation-2-5d-integration-solution-i-cube4-for-high-performance-applic
(PR) Samsung Announces Availability of Its Next Generation 2.5D Integration Solution I-Cube4 for High-Performance Applications
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again. Samsung's I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.Samsung's new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.
Original Link: https://www.techpowerup.com/281819/samsung-announces-availability-of-its-next-generation-2-5d-integration-solution-i-cube4-for-high-performance-applic
Share this article:
Tweet
View Full Article
Leading tech publication