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March 29, 2021 11:23 am GMT
The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities. They are recommended for applications requiring stable and sustained read/write performance at high temperatures. Both come with advanced Power Loss Protection (PLP), Low Density Parity Check (LDPC) ECC algorithm, RAID engine support, and end-to-end data path protection.
Original Link: https://www.techpowerup.com/280288/atp-introduces-copper-foil-fin-type-heatsink-and-thermal-pad-for-nvme-ssds
(PR) ATP Introduces Copper Foil, Fin-Type Heatsink and Thermal Pad for NVMe SSDs
ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with customizable thermal management. Using both hardware and firmware components, the thermal management solution prevents overheating while ensuring optimal sustained performance, particularly for NVMe solid state drives (SSDs) and modules that operate at blazing-fast speeds while installed in compact systems with little or no airflow.The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities. They are recommended for applications requiring stable and sustained read/write performance at high temperatures. Both come with advanced Power Loss Protection (PLP), Low Density Parity Check (LDPC) ECC algorithm, RAID engine support, and end-to-end data path protection.
Original Link: https://www.techpowerup.com/280288/atp-introduces-copper-foil-fin-type-heatsink-and-thermal-pad-for-nvme-ssds
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