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July 28, 2020 12:45 am

Intel Reorganizes In Wake of 7nm Woes; Chief Engineering Officer To Depart

FallOutBoyTonto shares a report from AnandTech: Coming in the wake of last week's disclosure that their 7nm yields are roughly a full year behind schedule, Intel this afternoon has announced that they are reorganizing the technology side of the company. Key to this change is that Intel is breaking up its monolithic Technology, Systems Architecture and Client Group (TSCG) into several smaller groups, all of which will report directly to CEO Bob Swan. Meanwhile Intel's chief engineering officer, Dr. Murthy Renduchintala, who had been leading the TSCG, will be departing the company at the end of next week. The reorganization is effective immediately. As a result of this reorganization, TSCG is being broken up into five groups focusing on manufacturing and architecture. These are: - Technology Development: Focused on developing next-generation process nodes. Led by Dr. Ann Kelleher.- Manufacturing and Operations: Focused on ramping current process nodes and building out new fab capacity. Led by Keyvan Esfarjani.- Design Engineering: A recently-created group responsible for Intel's technology manufacturing and platform engineering. Led on an interim basis by Josh Walden while Intel searches for a permanent leader.- Architecture, Software and Graphics: Developing Intel's architectures and associated software stacks. Led by Raja Koduri (continuing).- Supply Chain: Handling Intel's supply chain and relationships with important suppliers. Led by Dr. Randhir Thakur (continuing).

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