An Interest In:
Web News this Week
- April 25, 2024
- April 24, 2024
- April 23, 2024
- April 22, 2024
- April 21, 2024
- April 20, 2024
- April 19, 2024
June 10, 2020 03:11 pm
Illustration by Alex Castro / The Verge
Original Link: https://www.theverge.com/circuitbreaker/21285821/intel-3d-stacked-lakefield-chips-hybrid-core-atom-arm-processor
Intels 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets, and foldables
Illustration by Alex Castro / The Verge
Intel’s 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ultraportable, foldable, and dual-screen devices in what might be Intel’s best answer yet to ARM.
The new “Intel Core processors with Intel Hybrid Technology” (an official name that almost guarantees that people will continue to refer to them as Lakefield chips) debuts two major technologies on its chipsets for the first time: hybrid cores and a more compact stacked Foveros 3D design.
The new chips are designed to power smaller, ultralight devices, the first three of which have already been announced: the Intel version of the Galaxy Book S...
Original Link: https://www.theverge.com/circuitbreaker/21285821/intel-3d-stacked-lakefield-chips-hybrid-core-atom-arm-processor
Share this article:
Tweet
View Full Article
The Verge
The Verge is an ambitious multimedia effort founded in 2011More About this Source Visit The Verge