July 11, 2012 06:05 am
Intel Invests In ASML To Boost Extreme UV Lithography, 450mm Wafers
MrSeb writes "When Intel goes looking for new chip manufacturing technology to invest in, the company doesn't play for pennies. Chipzilla has announced a major investment and partial purchase of lithography equipment developer ASML. Intel has agreed to invest €829 million (~$1B USD) in ASML's R&D programs for EUV and 450mm wafer deployment, to purchase €1.7B worth of ASML shares ($2.1B USD, or roughly 10% of the total shares available) and to invest general R&D funds totaling €3.3B (~$4.1B USD). The goal is to bring 450mm wafer technology and extreme ultraviolet lithography (EUVL) within reach despite the challenges facing both deployments. Moving to 450mm wafers is a transition Intel and TSMC have backed for years, while smaller foundries (including GlobalFoundries, UMC, and Chartered, when it existed as a separate entity) have dug in their heels against the shift — mostly because the shift costs an insane amount of money. It's effectively impossible to retrofit 300mm equipment for 450mm wafers, which makes shifting from one to the other extremely expensive. EUVL is a technology that's been percolating in the background for years, but the deployment time frame has slipped steadily outwards as problems stubbornly refused to roll over and solve themselves. Basically, this investment is a signal from Intel that it intends to push its technological advantage over TSMC, GloFo, UMC, and Samsung, even further." Read more of this story at Slashdot.
Original Link: http://rss.slashdot.org/~r/Slashdot/slashdot/~3/MuBETilt8xw/intel-invests-in-asml-to-boost-extreme-uv-lithography-450mm-wafers
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